Capabilities
Factory-grade specs, in plain numbers
No guesswork. Here's exactly what NanoFab's lines can build—from prototype runs to production volumes.
Fabrication
- Layer count
- 1 – 22 layers
- Max board size
- 500 × 600 mm
- Min track / spacing
- 3 mil / 3 mil
- Min drill
- 0.15 mm mechanical · 0.1 mm laser
- Board thickness
- 0.4 – 3.2 mm
- Copper weight
- 0.5 – 6 oz
- Surface finish
- HASL · ENIG · OSP · Imm. Ag
- Solder mask
- Green · Blue · Red · Black · White
- Via types
- Through · Blind · Buried · Via-in-pad
- Impedance control
- ±10% with test report
Assembly
- Placement
- SMT + through-hole
- Smallest part
- 0201 / 01005 on request
- BGA pitch
- Down to 0.35 mm
- Inspection
- 100% AOI + X-ray for BGA
- Process
- Lead-free & leaded
- Coating
- Conformal coat · potting
- Volume
- 5 to 50,000+ boards
- Testing
- ICT · flying probe · functional
Materials
Substrates we work with
From everyday FR-4 to RF-grade laminates and metal-core boards for thermal management.
FR-4 standard TgHigh-Tg FR-4 (170°C)Rogers RO4350BAluminium / MCPCBPolyimide flexHalogen-free
Quality & compliance
Certified at every step
Documented processes and acceptance standards your auditors will recognise.
ISO 9001:2015IPC-A-600 Class 2 & 3IPC-A-610RoHS & REACHUL 94V-0
Not sure if we can build it?
Send us your stack-up or fab notes—our engineers will confirm feasibility within a day.